Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11182532 | Hierarchical density uniformization for semiconductor feature surface planarization | Venkata Sripathi Sasanka Pratapa, Jyun-Hong Chen | 2021-11-23 |
| 11094057 | Semiconductor wafer measurement method and system | Peng Chen, Shiang-Bau Wang, Yung-Jung Chang, Wei-Chung Hu, Yi-An Huang +1 more | 2021-08-17 |
| 11075179 | Semiconductor device and method of forming the same | Yen-Yu Chen, Chih-Wei Lin, Yi-Ming Dai | 2021-07-27 |
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Chih-Wei Lin, Chun-Chih Lin | 2021-02-09 |