Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177365 | Semiconductor device with adhesion layer | Shih Wei Bih, Yen-Yu Chen | 2021-11-16 |
| 11164957 | Semiconductor device with adhesion layer and method of making | Shih Wei Bih, Yen-Yu Chen | 2021-11-02 |
| 11095496 | Network failure detection method and network failure detection device | Yan Ma | 2021-08-17 |
| 10916517 | Redistribution layer metallic structure and method | Shih Wei Bih, Sheng-Wei Yeh, Yen-Yu Chen, Wen-Hao Cheng, Chih-Wei Lin | 2021-02-09 |