Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11182532 | Hierarchical density uniformization for semiconductor feature surface planarization | Venkata Sripathi Sasanka Pratapa, Wen-Hao Cheng | 2021-11-23 |
| 11094057 | Semiconductor wafer measurement method and system | Peng Chen, Shiang-Bau Wang, Wen-Hao Cheng, Yung-Jung Chang, Wei-Chung Hu +1 more | 2021-08-17 |