Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177156 | Semiconductor package, manufacturing method of semiconductor device and semiconductor package | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2021-11-16 |
| 11088124 | Package and manufacturing method thereof | Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Chieh Yang | 2021-08-10 |
| 10964663 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-30 |
| 10950572 | Die bonder and methods of using the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng | 2021-03-16 |