Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chih-Chiang Tsao +2 more | 2021-12-28 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Kuei-Wei Huang +3 more | 2021-07-20 |
| 11002927 | Package structure | Chia-Lun Chang, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hsuan-Ting Kuo +1 more | 2021-05-11 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chih-Chiang Tsao, Cheng-Ting Chen, Chia-Lun Chang +4 more | 2021-04-13 |
| 10903090 | Method of singulate a package structure using a light transmitting film on a polymer layer | Cheng-Ting Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Hao-Jan Pei, Wei-Yu Chen +2 more | 2021-01-26 |