Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211341 | Package structure and method of fabrcating the same | Hao-Jan Pei, Ching-Hua Hsieh, Hsiu-Jen Lin, Wei-Yu Chen, Chia-Shen Cheng +2 more | 2021-12-28 |
| 11121089 | Integrated circuit package and method | Hao-Jan Pei, Wei-Yu Chen, Chia-Lun Chang, Hsiu-Jen Lin, Ching-Hua Hsieh | 2021-09-14 |