Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11152258 | Method of forming an interconnect in a semiconductor device | Pei-Hsuan Lee, Yu Liu | 2021-10-19 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Hung-Wen Su | 2021-05-11 |