Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11004734 | Metal-based etch-stop layer | Yu-Kai Lin, Jen Hung Wang, Shing-Chyang Pan | 2021-05-11 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Chih-Chien Chi, Hung-Wen Su | 2021-05-11 |