Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177168 | Device and method for reducing contact resistance of a metal | Ya-Lien Lee, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2021-11-16 |
| 11062909 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Ya-Lien Lee, Chun-Chieh Lin | 2021-07-13 |
| 11018055 | Physical vapor deposition process for semiconductor interconnection structures | Nai-Hao Yang, Kuan-Chia Chen | 2021-05-25 |
| 11004793 | Method of forming an interconnect structure having an air gap and structure thereof | Szu-Ping Tung, Chih-Chien Chi | 2021-05-11 |
| 10998269 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Ming-Hsing Tsai, Syun-Ming Jang | 2021-05-04 |