Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2021-12-07 |
| 11062941 | Contact conductive feature formation and structure | Ken-Yu Chang, Chun-I Tsai, Wei-Jung Lin | 2021-07-13 |
| 10998269 | Chemical direct pattern plating method | Wen-Jiun Liu, Chen-Yuan Kao, Hung-Wen Su, Syun-Ming Jang | 2021-05-04 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Wei-Jung Lin | 2021-04-06 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Wei-Jung Lin +3 more | 2021-03-09 |