Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11020446 | Method for preparing tea leaf extract | Yung-Han Hung, Yu-Tsai Chen | 2021-06-01 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai, Wei-Jung Lin +3 more | 2021-03-09 |