Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Chun-I Tsai +4 more | 2021-12-07 |
| 11031286 | Conductive feature formation and structure | Wei-Yip Loh, Chih-Wei Chang, Chun-Hsien Huang, Yu-Ming Huang, Yan-Ming Tsai +4 more | 2021-06-08 |