Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Hong-Mao Lee, Chun-I Tsai +4 more | 2021-12-07 |
| 10985058 | Semiconductor device and formation thereof | Yu-Hung Lin, You-Hua Chou, Chih-Wei Chang | 2021-04-20 |
| 10964590 | Contact metallization process | Tien-Pei Chou, Ken-Yu Chang, Yueh-Ching Pai, Yu-Ting Lin | 2021-03-30 |