Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195791 | Method for forming semiconductor contact structure | Yu-Wen Cheng, Wei-Yip Loh, Yu-Hsiang Liao, Sheng-Hsuan Lin, Hong-Mao Lee +4 more | 2021-12-07 |
| 11062941 | Contact conductive feature formation and structure | Chun-I Tsai, Ming-Hsing Tsai, Wei-Jung Lin | 2021-07-13 |
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Shian Wei Mao, Ming-Hsing Tsai, Wei-Jung Lin | 2021-04-06 |
| 10964590 | Contact metallization process | Tien-Pei Chou, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin | 2021-03-30 |