Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195752 | Semiconductor device and method of forming same | Kuo-Bin Huang, Ming-Hsi Yeh, Po-Nan Yeh | 2021-12-07 |
| 11164789 | Method for forming semiconductor device that includes covering metal gate with multilayer dielectric | Tsai-Jung Ho, Tze-Liang Lee | 2021-11-02 |
| 11157046 | Electronic device | Ting-Wen Pai, Wen-Chieh Tai, Cheng-Nan Ling, Chih-Chun Liu | 2021-10-26 |
| 11146031 | Expansion device | Ting-Wen Pai, Wen-Chieh Tai, Han-Tsung Shen | 2021-10-12 |
| 11009974 | Touch pad structure | Ting-Wen Pai, Chih-Chun Liu, Chien-Yuan Chen | 2021-05-18 |
| 10971396 | Conductive feature formation and structure | Chun-I Tsai, Shian Wei Mao, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2021-04-06 |
| 10943823 | Conductive feature formation and structure using bottom-up filling deposition | Pin-Wen Chen, Chia-Han Lai, Chih-Wei Chang, Mei-Hui Fu, Ming-Hsing Tsai +3 more | 2021-03-09 |