Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10971396 | Conductive feature formation and structure | Yu-Shih Wang, Chun-I Tsai, Ken-Yu Chang, Ming-Hsing Tsai, Wei-Jung Lin | 2021-04-06 |
| 10971628 | FinFET device with T-shaped fin | Chun-Neng Lin | 2021-04-06 |