Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11183424 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2021-11-23 |
| 11177168 | Device and method for reducing contact resistance of a metal | Hung-Wen Su, Kuei-Pin Lee, Yu-Hung Lin, Yu-Min Chang | 2021-11-16 |
| 11145542 | Global dielectric and barrier layer | — | 2021-10-12 |
| 11062909 | Interconnect structure having a carbon-containing barrier layer | Rueijer Lin, Chun-Chieh Lin, Hung-Wen Su | 2021-07-13 |
| 11043416 | Gradient atomic layer deposition | Chia-Pang Kuo | 2021-06-22 |
| 11043413 | Barrier layer formation for conductive feature | Chia-Pang Kuo | 2021-06-22 |
| 10950495 | Mitigating pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen | 2021-03-16 |