Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088021 | Interconnect structure and method of forming the same | Chih-Yuan Ting | 2021-08-10 |
| 11043453 | Method of preventing pattern collapse | Chih-Yuan Ting, Chung-Wen Wu, Jang-Shiang Tsai, Jyu-Horng Shieh | 2021-06-22 |
| 10985054 | Interconnect structure and method of forming the same | Chih-Yuan Ting, Jyu-Horng Shieh, Minghsing Tsai | 2021-04-20 |
| 10950495 | Mitigating pattern collapse | Chih-Yuan Ting, Ya-Lien Lee, Chung-Wen Wu | 2021-03-16 |