Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158509 | Pattern fidelity enhancement with directional patterning technology | Yu-Tien Shen, Chi-Cheng Hung, Chin-Hsiang Lin, Chien-Wei Wang, Ching-Yu Chang +7 more | 2021-10-26 |
| 11127630 | Contact plug without seam hole and methods of forming the same | Jyu-Horng Shieh | 2021-09-21 |
| 11101429 | Metal etching stop layer in magnetic tunnel junction memory cells | Tai-Yen Peng, Sin-Yi Yang, Chen-Jung Wang, Yu-Shu Chen, Chien-Chung Huang +2 more | 2021-08-24 |
| 11088021 | Interconnect structure and method of forming the same | Jeng-Shiou Chen | 2021-08-10 |
| 11043453 | Method of preventing pattern collapse | Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai, Jyu-Horng Shieh | 2021-06-22 |
| 11037981 | Semiconductor device with magnetic tunnel junctions | Tai-Yen Peng, Tsung-Hsien Chang, Yu-Shu Chen, Jyu-Horng Shieh, Chung-Te Lin | 2021-06-15 |
| 11024515 | Systems and methods for in SITU maintenance of a thin hardmask during an etch process | Chung-Wen Wu | 2021-06-01 |
| 10985054 | Interconnect structure and method of forming the same | Jeng-Shiou Chen, Jyu-Horng Shieh, Minghsing Tsai | 2021-04-20 |
| 10950495 | Mitigating pattern collapse | Ya-Lien Lee, Chung-Wen Wu, Jeng-Shiou Chen | 2021-03-16 |
| 10923423 | Interconnect structure for semiconductor devices | — | 2021-02-16 |