Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11107896 | Vertical interconnect features and methods of forming | Po-Yu Huang, Shih-Che Lin, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang +2 more | 2021-08-31 |
| 11062909 | Interconnect structure having a carbon-containing barrier layer | Ya-Lien Lee, Chun-Chieh Lin, Hung-Wen Su | 2021-07-13 |