Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189525 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Wang-Jung Hsueh | 2021-11-30 |
| 11177212 | Contact formation method and related structure | Po-Yu Huang, Shih-Che Lin, Chao-Hsun Wang, Mei-Yun Wang | 2021-11-16 |
| 11127684 | Low-resistance interconnect structures | Chao-Hsun Wang, Wang-Jung Hsueh, Mei-Yun Wang, Ru-Gun Liu | 2021-09-21 |
| 11107896 | Vertical interconnect features and methods of forming | Po-Yu Huang, Shih-Che Lin, Chao-Hsun Wang, Mei-Yun Wang, Feng-Yu Chang +2 more | 2021-08-31 |
| 10957604 | Semiconductor device and method | Shih-Chieh Wu, Pang-Chi Wu, Mei-Yun Wang, Hsien-Huang Liao, Tung-Heng Hsieh +1 more | 2021-03-23 |
| 10950728 | Fin field effect transistor (FinFET) device structure with isolation layer and method for forming the same | Chung-Huai CHANG, Chao-Hsun Wang, Mei-Yun Wang | 2021-03-16 |
| 10923573 | Forming metal contacts on metal gates | Chao-Hsun Wang, Yu-Feng Yin, Mei-Yun Wang, Feng-Yu Chang, Chen-Yuan Kao | 2021-02-16 |