Issued Patents 2021
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198792 | Method for preparing patterned coverlay on substrate | Chung-Kai Cheng, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Shun-Jen Chiang | 2021-12-14 |
| 11177212 | Contact formation method and related structure | Shih-Che Lin, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang | 2021-11-16 |
| 11106190 | System and method for predicting remaining lifetime of a component of equipment | Chuang-Hua Chueh, Jia-Min Ren | 2021-08-31 |
| 11107896 | Vertical interconnect features and methods of forming | Shih-Che Lin, Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Feng-Yu Chang +2 more | 2021-08-31 |
| 11034797 | Polyimide precursor composition, use thereof and polyimide made therefrom | Meng-Yen Chou, Chung-Jen Wu, Chang-Hong Ho, Shun-Jen Chiang, Chung-Kai Cheng | 2021-06-15 |
| 10995179 | Polyimide resin and metal-clad laminate comprising the same | Shun-Jen Chiang, Chung-Jen Wu, Meng-Yen Chou, Chang-Hong Ho, Chun-Kai Cheng | 2021-05-04 |
| 10929472 | Methods, devices and non-transitory computer-readable medium for parameter optimization | Hong-Chi Ku, Sen-Chia Chang, Te-Ming Chen, Pei-Yi Lo | 2021-02-23 |