Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11198792 | Method for preparing patterned coverlay on substrate | Chung-Kai Cheng, Chung-Jen Wu, Meng-Yen Chou, Po-Yu Huang, Shun-Jen Chiang | 2021-12-14 |
| 11034797 | Polyimide precursor composition, use thereof and polyimide made therefrom | Meng-Yen Chou, Chung-Jen Wu, Shun-Jen Chiang, Po-Yu Huang, Chung-Kai Cheng | 2021-06-15 |
| 10995179 | Polyimide resin and metal-clad laminate comprising the same | Shun-Jen Chiang, Chung-Jen Wu, Po-Yu Huang, Meng-Yen Chou, Chun-Kai Cheng | 2021-05-04 |