Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189525 | Via-first process for connecting a contact and a gate electrode | Chao-Hsun Wang, Mei-Yun Wang, Kuo-Yi Chao | 2021-11-30 |
| 11127684 | Low-resistance interconnect structures | Chao-Hsun Wang, Kuo-Yi Chao, Mei-Yun Wang, Ru-Gun Liu | 2021-09-21 |