Issued Patents 2021
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10950572 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Ming-Da Cheng | 2021-03-16 |
| 10950519 | Integrated circuit package and method | Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai +2 more | 2021-03-16 |
| 10937721 | Semiconductor structure | Jiun Yi Wu, Chen-Hua Yu, Chien-Hsun Lee | 2021-03-02 |
| 10916519 | Method for manufacturing semiconductor package with connection structures including via groups | Chien-Hsun Chen, Jiun Yi Wu, Chien-Hsun Lee | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2021-01-05 |