Issued Patents 2021
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088110 | Semiconductor device, circuit board structure and manufacturing method thereof | Tin-Hao Kuo, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng | 2021-08-10 |
| 11088069 | Semiconductor package and semiconductor device | Hao-Cheng Hou, Chien-Hsun Lee, Jung Wei Cheng, Tsung-Ding Wang | 2021-08-10 |
| 11069671 | Semiconductor package and method | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2021-07-20 |
| 11069652 | Method of manufacturing semiconductor structure | Alexander Kalnitsky, Yi-Yang Lei, Hsi-Ching Wang, Cheng-Yu Kuo, Tsung Lung Huang +9 more | 2021-07-20 |
| 11062975 | Package structures | Yu-Chia Lai, Chen-Hua Yu, Hao-Yi Tsai, Kuo-Chung Yee, Tin-Hao Kuo | 2021-07-13 |
| 11056474 | Semiconductor package, semiconductor device and method of forming the same | Chen-Hua Yu, Chih-Fan Huang, Tsai-Tsung Tsai, Wei-Hung Lin, Ming-Da Cheng | 2021-07-06 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Ting-Ting Kuo +4 more | 2021-06-29 |
| 11049832 | Formation method of package structure with warpage-control element | Hao-Jan Pei, Chih-Chiang Tsao, Wei-Yu Chen, Hsiu-Jen Lin, Ming-Da Cheng +1 more | 2021-06-29 |
| 11043463 | Interconnect structures and methods of forming same | Wen-Hsiung Lu, Hsuan-Ting Kuo, Tsung-Yuan Yu, Hsien-Wei Chen, Ming-Da Cheng | 2021-06-22 |
| 11043731 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chao-Wen Shih, Shou-Zen Chang | 2021-06-22 |
| 11024594 | Substrate and package structure | Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen | 2021-06-01 |
| 11024618 | Wafer-level underfill and over-molding | Bor-Ping Jang, Chien Ling Hwang, Yeong-Jyh Lin | 2021-06-01 |
| 11010580 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chen-Hua Yu, Hao-Yi Tsai, Yu-Chih Huang | 2021-05-18 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2021-05-11 |
| 11006532 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chen-Hua Yu | 2021-05-11 |
| 11004803 | Dummy dies for reducing warpage in packages | Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai | 2021-05-11 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chen-Hua Yu | 2021-04-20 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Bor-Ping Jang, Jen-Chun Liao, Yeong-Jyh Lin, Hsiao-Chung Liang | 2021-04-20 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Kuo-Chung Yee +1 more | 2021-04-20 |
| 10978370 | Integrated fan-out packages with embedded heat dissipation structure | Hao-Jan Pei, Wei-Yu Chen, Chia-Shen Cheng, Chih-Chiang Tsao, Cheng-Ting Chen +4 more | 2021-04-13 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2021-04-13 |
| 10971460 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Shou-Zen Chang, Chao-Wen Shih | 2021-04-06 |
| 10964663 | Die bonder and methods of using the same | Chen-Hua Yu, Shing-Chao Chen, Ming-Da Cheng | 2021-03-30 |
| 10964641 | Method of forming semiconductor packages having through package vias | Chen-Hua Yu, Chih-Wei Lin, Ming-Da Cheng | 2021-03-30 |
| 10950514 | Packaged semiconductor devices and methods of packaging semiconductor devices | Chen-Hua Yu, Chih-Fan Huang, Chih-Wei Lin, Wei-Hung Lin, Ming-Da Cheng | 2021-03-16 |