Issued Patents 2021
Showing 101–125 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11010580 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chih Huang | 2021-05-18 |
| 11011464 | Package structures and method of forming the same | An-Jhih Su | 2021-05-18 |
| 11008456 | Resin composition and uses of the same | Chih-Wei Liao, Guan-Syun Tseng | 2021-05-18 |
| 11004758 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee +3 more | 2021-05-11 |
| 11006532 | Circuit carrier and manifacturing method thereof | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2021-05-11 |
| 11004832 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Weng-Jin Wu, Wen-Chih Chiou | 2021-05-11 |
| 11004826 | 3DIC formation with dies bonded to formed RDLs | Sung-Feng Yeh, Ming-Fa Chen | 2021-05-11 |
| 11004811 | Semiconductor structure | Vincent Chen, Hung-Yi Kuo, Chuei-Tang Wang, Hao-Yi Tsai, Wei-Ting Chen +2 more | 2021-05-11 |
| 11004809 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Chao-Wen Shih +2 more | 2021-05-11 |
| 11004803 | Dummy dies for reducing warpage in packages | Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2021-05-11 |
| 11004799 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Kuo-Chung Yee | 2021-05-11 |
| 11004741 | Profile of through via protrusion in 3DIC interconnect | Jiung Wu, Kuan-Liang Lai, Ming-Tsu Chung, Hong-Ye Shih, Ku-Feng Yang +3 more | 2021-05-11 |
| 10996410 | Methods of forming semiconductor packages | Chuei-Tang Wang, Jeng-Shien Hsieh, Hsing-Kuo Hsia | 2021-05-04 |
| 10992100 | Semiconductor device and method | An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2021-04-27 |
| 10985122 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2021-04-20 |
| 10985101 | Semiconductor package and manufacturing method thereof | Yu-Chia Lai, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2021-04-20 |
| 10978424 | Semiconductor device and manufacturing method thereof | Wen-Chih Chiou | 2021-04-13 |
| 10978781 | 3D antenna for integrated circuits | Jeng-Shien Hsieh, Chung-Hao Tsai, Chuei-Tang Wang | 2021-04-13 |
| 10978382 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2021-04-13 |
| 10971446 | Semiconductor device and method of manufacture | Jiun Yi Wu, Chien-Hsun Chen | 2021-04-06 |
| 10971477 | Semiconductor packages and methods of forming the same | Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2021-04-06 |
| 10971462 | Package structure and manufacturing method thereof | Kuo-Chung Yee | 2021-04-06 |
| 10971460 | Integrated devices in semiconductor packages and methods of forming same | Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2021-04-06 |
| 10971443 | Packages with Si-substrate-free interposer and method forming same | Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2021-04-06 |
| 10971442 | Semiconductor device having via sidewall adhesion with encapsulant | Yun Chen Hsieh, Hui-Jung Tsai, Hung-Jui Kuo | 2021-04-06 |