Issued Patents 2021
Showing 151–161 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10937734 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2021-03-02 |
| 10937718 | Package structures and method of forming the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Feng Chen | 2021-03-02 |
| 10930633 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2021-02-23 |
| 10930628 | Photonic semiconductor device and method | Chih-Chieh Chang, Chung-Hao Tsai, Chuei-Tang Wang, Hsing-Kuo Hsia | 2021-02-23 |
| 10923417 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chewn-Pu Jou, Feng-Wei Kuo | 2021-02-16 |
| 10923431 | Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2021-02-16 |
| 10920008 | Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same | Ju-Ming Huang, Chang-Chien Yang, Guan-Syun Tseng, Chih-Wei Liao | 2021-02-16 |
| 10914895 | Package structure and manufacturing method thereof | Yu-Kuang Liao, Cheng-Chun Tsai, Fang Chen, Wen-Chih Chiou, Ping-Jung Wu | 2021-02-09 |
| 10916529 | Electronics card including multi-chip module | Chien-Hsun Lee, Jiun Yi Wu | 2021-02-09 |
| 10888000 | Manufacturing method of circuit board and of semiconductor device including the same | Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu | 2021-01-05 |
| 10886231 | Method of forming RDLS and structure formed thereof | Hung-Jui Kuo, Yun Chen Hsieh, Hui-Jung Tsai | 2021-01-05 |