Issued Patents All Time
Showing 526–550 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8952506 | Through silicon via structure | Chen-Hua Yu, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai | 2015-02-10 |
| 8937389 | Semiconductor devices comprising GSG interconnect structures | Christianto Chih-Ching Liu, Shuo-Mao Chen, Der-Chyang Yeh, Shang-Yun Hou | 2015-01-20 |
| 8928159 | Alignment marks in substrate having through-substrate via (TSV) | Hsin Chang, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou | 2015-01-06 |
| 8906798 | Methods of manufacturing stress buffer structures in a mounting structure of a semiconductor device | Tzu-Yu Wang, Tzu-Wei Chiu | 2014-12-09 |
| 8900994 | Method for producing a protective structure | Chen-Hua Yu, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai | 2014-12-02 |
| 8901735 | Connector design for packaging integrated circuits | Chen-Hua Yu, Ying-Ching Shih, Po-Hao Tsai, Chin-Fu Kao, Cheng-Lin Huang +4 more | 2014-12-02 |
| 8896136 | Alignment mark and method of formation | Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai +4 more | 2014-11-25 |
| 8878338 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Der-Chyang Yeh, Kuang-Wei Cheng, Yuan-Hung Liu, Shang-Yun Hou +1 more | 2014-11-04 |
| 8878182 | Probe pad design for 3DIC package yield analysis | Tzu-Yu Wang, Chen-Hua Yu, Shang-Yun Hou, Hsien-Pin Hu, Wei-Cheng Wu +2 more | 2014-11-04 |
| 8872345 | Forming grounded through-silicon vias in a semiconductor substrate | Chi-Chun Hsieh, Wei-Cheng Wu, Hsiao-Tsung Yen, Hsien-Pin Hu, Shang-Yun Hou | 2014-10-28 |
| 8865521 | 3D semiconductor package interposer with die cavity | Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2014-10-21 |
| 8860208 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Chen-Hua Yu +1 more | 2014-10-14 |
| 8846499 | Composite carrier structure | Ying-Ching Shih, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2014-09-30 |
| 8847388 | Bump with protection structure | Chen-Hua Yu, Hung-Pin Chang, An-Jhih Su, Tsang-Jiuh Wu, Wen-Chih Chiou | 2014-09-30 |
| 8829676 | Interconnect structure for wafer level package | Chen-Hua Yu, Jing-Cheng Lin, Nai-Wei Liu, Jui-Pin Hung | 2014-09-09 |
| 8810006 | Interposer system and method | Chen-Hua Yu, Shang-Yun Hou, Der-Chyang Yeh | 2014-08-19 |
| 8802504 | 3D packages and methods for forming the same | Shang-Yun Hou, Sao-Ling Chiu, Ping-Kang Huang, Wen-Hsin Wei, Wen-Chih Chiou +1 more | 2014-08-12 |
| 8797057 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Chen-Hua Yu, Chao-Hsiang Yang | 2014-08-05 |
| 8779599 | Packages including active dies and dummy dies and methods for forming the same | Jing-Cheng Lin, Cheng-Lin Huang, Szu-Wei Lu, Jui-Pin Hung, Chen-Hua Yu | 2014-07-15 |
| 8765549 | Capacitor for interposers and methods of manufacture thereof | Chun Hua Chang, Der-Chyang Yeh, Shang-Yun Hou, Wen-Chih Chiou | 2014-07-01 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Chen-Hua Yu, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2014-06-24 |
| 8753971 | Dummy metal design for packaging structures | Tzuan-Horng Liu, Shang-Yun Hou, Wei-Cheng Wu, Hsiu-Ping Wei, Chih-Hua Chen +3 more | 2014-06-17 |
| 8749020 | Metal e-fuse structure design | Hsien-Wei Chen, Hao-Yi Tsai, Shih-Hsun Hsu | 2014-06-10 |
| 8749077 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Chen-Hua Yu | 2014-06-10 |
| 8749027 | Robust TSV structure | Hsien-Wei Chen, Hung-Jung Tu, Wen-Chih Chiou | 2014-06-10 |