Issued Patents All Time
Showing 551–575 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8722529 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Ying-Ju Chen | 2014-05-13 |
| 8716867 | Forming interconnect structures using pre-ink-printed sheets | Francis Ko, Chi-Chun Hsieh, Shang-Yun Hou, Wen-Chih Chiou, Chen-Hua Yu | 2014-05-06 |
| 8693163 | Cylindrical embedded capacitors | An-Jhih Su, Chi-Chun Hsieh, Tzu-Yu Wang, Wei-Cheng Wu, Hsien-Pin Hu +2 more | 2014-04-08 |
| 8674513 | Interconnect structures for substrate | Chen-Hua Yu, Wen-Chih Chiou, Tsang-Jiuh Wu | 2014-03-18 |
| 8669174 | Multi-die stacking using bumps with different sizes | Weng-Jin Wu, Ying-Ching Shih, Wen-Chih Chiou, Chen-Hua Yu | 2014-03-11 |
| 8664760 | Connector design for packaging integrated circuits | Chen-Hua Yu, Shang-Yun Hou, Cheng-Chieh Hsieh, Kuo-Ching Hsu, Ying-Ching Shih +4 more | 2014-03-04 |
| 8648444 | Wafer scribe line structure for improving IC reliability | Hsien-Wei Chen, Hao-Yi Tsai, Yu-Wen Liu | 2014-02-11 |
| 8643147 | Seal ring structure with improved cracking protection and reduced problems | Shih-Hsun Hsu, Shang-Yun Hou, Hao-Yi Tsai, Chen-Hua Yu | 2014-02-04 |
| 8629568 | Semiconductor device cover mark | Yan-Fu Lin, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2014-01-14 |
| 8618673 | Package structures | Benson Liu, Hsien-Wei Chen, Hao-Yi Tsai | 2013-12-31 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Chen-Hua Yu, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2013-12-17 |
| 8604619 | Through silicon via keep out zone formation along different crystal orientations | Cheng-Chieh Hsieh, Hung-An Teng, Shang-Yun Hou | 2013-12-10 |
| 8581418 | Multi-die stacking using bumps with different sizes | Weng-Jin Wu, Ying-Ching Shih, Wen-Chih Chiou, Chen-Hua Yu | 2013-11-12 |
| 8581423 | Double solid metal pad with reduced area | Hsien-Wei Chen, Yu-Wen Liu, Hao-Yi Tsai, Ying-Ju Chen | 2013-11-12 |
| 8567837 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2013-10-29 |
| 8569086 | Semiconductor device and method of dicing semiconductor devices | Jing-Cheng Lin, Chih-Wei Wu, Szu-Wei Lu, Chen-Hua Yu | 2013-10-29 |
| 8557684 | Three-dimensional integrated circuit (3DIC) formation process | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Chen-Hua Yu | 2013-10-15 |
| 8558229 | Passivation layer for packaged chip | Wei-Cheng Wu, Shang-Yun Hou, Chen-Hua Yu, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2013-10-15 |
| 8540506 | Semiconductor molding chamber | Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2013-09-24 |
| 8519512 | Test line placement to improve die sawing quality | Hao-Yi Tsai, Chia-Lun Tsai, Shang-Yun Hou, Shih-Hsun Hsu, Wei-Ti Hsu +2 more | 2013-08-27 |
| 8519537 | 3D semiconductor package interposer with die cavity | Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh, Chen-Hua Yu | 2013-08-27 |
| 8518753 | Assembly method for three dimensional integrated circuit | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Chen-Hua Yu | 2013-08-27 |
| 8450126 | Semiconductor test pad structures | Hsien-Wei Chen, Ying-Ju Chen, Yu-Wen Liu, Hao-Yi Tsai | 2013-05-28 |
| 8426961 | Embedded 3D interposer structure | Ying-Ching Shih, Jing-Cheng Lin, Wen-Chih Chiou, Chen-Hua Yu | 2013-04-23 |
| 8377816 | Method of forming electrical connections | Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu | 2013-02-19 |