Issued Patents All Time
Showing 601–625 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7936067 | Backend interconnect scheme with middle dielectric layer having improved strength | Hao-Yi Tsai, Yu-Wen Liu, Hsien-Wei Chen, Ying-Ju Chen | 2011-05-03 |
| 7906836 | Heat spreader structures in scribe lines | Hsien-Wei Chen, Yu-Wen Liu, Jyh-Cherng Sheu, Hao-Yi Tsai, Chen-Hua Yu +1 more | 2011-03-15 |
| 7880278 | Integrated circuit having stress tuning layer | Clinton Chao, Szu-Wei Lu | 2011-02-01 |
| 7859092 | Package structures | Benson Liu, Hsien-Wei Chen, Hao-Yi Tsai | 2010-12-28 |
| 7811866 | Single passivation layer scheme for forming a fuse | Hao-Yi Tsai, Shang-Yun Hou, Anbiarshy Wu, Chia-Lun Tsai | 2010-10-12 |
| 7803713 | Method for fabricating air gap for semiconductor device | Hsien-Wei Chen, Hsueh-Chung Chen | 2010-09-28 |
| 7776627 | Flexible structures for interconnect reliability test | Shang-Yun Hou, Hao-Yi Tsai, Anbiarshy Wu | 2010-08-17 |
| 7754601 | Semiconductor interconnect air gap formation process | Hsien-Wei Chen, Hao-Yi Tsai | 2010-07-13 |
| 7732892 | Fuse structures and integrated circuit devices | Anbiarshy Wu | 2010-06-08 |
| 7732897 | Methods of die sawing and structures formed thereby | Hao-Yi Tsai | 2010-06-08 |
| 7714443 | Pad structure design with reduced density | Hsien-Wei Chen, Anbiarshy Wu, Shih-Hsun Hsu, Shang-Yun Hou, Hsueh-Chung Chen | 2010-05-11 |
| 7705696 | Structure design for minimizing on-chip interconnect inductance | Hsien-Wei Chen, Hsueh-Chung Chen | 2010-04-27 |
| 7679384 | Parametric testline with increased test pattern areas | Hsien-Wei Chen, Shih-Hsun Hsu, Hao-Yi Tsai | 2010-03-16 |
| 7651725 | Low dielectric constant film produced from silicon compounds comprising silicon-carbon bond | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2010-01-26 |
| 7651893 | Metal electrical fuse structure | Hsueh-Chung Chen, Hao-Yi Tsai, Hsien-Wei Chen, Shang-Yun Hou | 2010-01-26 |
| 7646078 | Die saw crack stopper | Shih-Hsun Hsu | 2010-01-12 |
| 7602065 | Seal ring in semiconductor device | Shang-Yun Hou, Chun-Hung Chen, Chia-Lun Tsai, Pao-Kang Niu | 2009-10-13 |
| 7560377 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2009-07-14 |
| 7512924 | Semiconductor device structure and methods of manufacturing the same | Hsien-Wei Chen, Hsueh-Chung Chen, Yi-Lung Cheng | 2009-03-31 |
| 7449785 | Solder bump on a semiconductor substrate | Hao-Yi Tsai, Shang-Yun Hou, Hsien-Wei Chen, Chia-Lun Tsai | 2008-11-11 |
| 7420277 | System for heat dissipation in semiconductor devices | Hsien-Wei Chen, Jiun-Lin Yeh, Yi-Lung Cheng | 2008-09-02 |
| 7397106 | Laser fuse with efficient heat dissipation | Hao-Yi Tsai, Chao-Hsiang Yang, Shang-Yun Hou, Chia-Lun Tsai | 2008-07-08 |
| 7348672 | Interconnects with improved reliability | Hsien-Wei Chen, Hsueh-Chung Chen | 2008-03-25 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou +2 more | 2007-11-13 |
| 7235424 | Method and apparatus for enhanced CMP planarization using surrounded dummy design | Hsien-Wei Chen, Hao-Yi Tsai, Hsueh-Chung Chen, Jian-Hong Lin, Chih-Tao Lin +1 more | 2007-06-26 |