Issued Patents All Time
Showing 626–650 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7233075 | Bonding pad structure | Meng-Chi Hung, Shang-Yung Hou | 2007-06-19 |
| 7223630 | Low stress semiconductor device coating and method of forming thereof | — | 2007-05-29 |
| 7205588 | Metal fuse for semiconductor devices | Chi-Hsi Wu, Shang-Yun Hou | 2007-04-17 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Chao-Yuan Su, Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou +2 more | 2006-10-24 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2006-07-11 |
| 7057296 | Bonding pad structure | Meng-Chi Hung, Shang-Yung Hou | 2006-06-06 |
| 7023092 | Low dielectric constant film produced from silicon compounds comprising silicon-carbon bonds | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2006-04-04 |
| 6930061 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2005-08-16 |
| 6869896 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2005-03-22 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2004-08-31 |
| 6777318 | Aluminum/copper clad interconnect layer for VLSI applications | Shang-Yun Hou | 2004-08-17 |
| 6770556 | Method of depositing a low dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2004-08-03 |
| 6753210 | Metal fuse for semiconductor devices | Chi-Hsi Wu, Shang-Yun Hou | 2004-06-22 |
| 6734115 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2004-05-11 |
| 6730593 | Method of depositing a low K dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2004-05-04 |
| 6709715 | Plasma enhanced chemical vapor deposition of copolymer of parylene N and comonomers with various double bonds | Chi-I Lang, Yeming Jim Ma, Fong Chang, Peter Wai-Man Lee, David Cheung | 2004-03-23 |
| 6660656 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-12-09 |
| 6645878 | Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman, Richard Stoltz, Alok Maskara +2 more | 2003-11-11 |
| 6627532 | Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Ellie Yieh, Wai-Fan Yau +2 more | 2003-09-30 |
| 6596655 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-07-22 |
| 6562690 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-05-13 |
| 6541282 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2003-04-01 |
| 6511909 | Method of depositing a low K dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2003-01-28 |
| 6511903 | Method of depositing a low k dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2003-01-28 |
| 6437007 | Aerogel thin film formation from multi-solvent systems | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman, Bruce E. Gnade | 2002-08-20 |