Issued Patents All Time
Showing 676–694 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5753305 | Rapid aging technique for aerogel thin films | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman | 1998-05-19 |
| 5747880 | Interconnect structure with an integrated low density dielectric | Robert H. Havemann, Bruce E. Gnade, Chih-Chen Cho | 1998-05-05 |
| 5744865 | Highly thermally conductive interconnect structure for intergrated circuits | Mi-Chang Chang | 1998-04-28 |
| 5733160 | Method of forming spacers for a flat display apparatus | Johnson Lin, Bruce E. Gnade, Dennis I. Robbins | 1998-03-31 |
| 5708303 | Semiconductor device having damascene interconnects | — | 1998-01-13 |
| 5684356 | Hydrogen-rich, low dielectric constant gate insulator for field emission device | Bruce E. Gnade | 1997-11-04 |
| 5668411 | Diffusion barrier trilayer for minimizing reaction between metallization layers of integrated circuits | Qi-Zhong Hong, Robert H. Havemann | 1997-09-16 |
| 5668398 | Multilevel interconnect structure with air gaps formed between metal leads | Robert H. Havemann | 1997-09-16 |
| 5654575 | TiSi.sub.2 /TiN clad interconnect technology | — | 1997-08-05 |
| 5621235 | TiSi.sub.2 /TiN clad interconnect technology | — | 1997-04-15 |
| 5616959 | Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators | — | 1997-04-01 |
| 5591677 | Planarizeed multi-level interconnect scheme with embedded low-dielectric constant insulators | — | 1997-01-07 |
| 5589417 | TiSi.sub.2 /TiN clad interconnect technology | — | 1996-12-31 |
| 5548159 | Porous insulator for line-to-line capacitance reduction | — | 1996-08-20 |
| 5527737 | Selective formation of low-density, low-dielectric-constant insulators in narrow gaps for line-to-line capacitance reduction | — | 1996-06-18 |
| 5488015 | Method of making an interconnect structure with an integrated low density dielectric | Robert H. Havemann, Bruce E. Gnade, Chih-Chen Cho | 1996-01-30 |
| 5486493 | Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators | — | 1996-01-23 |
| 5461003 | Multilevel interconnect structure with air gaps formed between metal leads | Robert H. Havemann | 1995-10-24 |
| 5453157 | Low temperature anisotropic ashing of resist for semiconductor fabrication | — | 1995-09-26 |