Issued Patents All Time
Showing 651–675 of 694 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6413583 | Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound | Farhad Moghadam, David Cheung, Ellie Yieh, Li-Qun Xia, Wai-Fan Yau +4 more | 2002-07-02 |
| 6380105 | Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman, Richard Stoltz, Alok Maskara +2 more | 2002-04-30 |
| 6348725 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2002-02-19 |
| 6319852 | Nanoporous dielectric thin film formation using a post-deposition catalyst | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman | 2001-11-20 |
| 6303523 | Plasma processes for depositing low dielectric constant films | David Cheung, Wai-Fan Yau, Robert P. Mandal, Kuo-Wei Liu, Yung-Cheng Lu +5 more | 2001-10-16 |
| 6146968 | Method for forming a crown capacitor | Yii-Chian Lu, Chine-Gie Lou | 2000-11-14 |
| 6130152 | Aerogel thin film formation from multi-solvent systems | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman, Bruce E. Gnade | 2000-10-10 |
| 6114186 | Hydrogen silsesquioxane thin films for low capacitance structures in integrated circuits | Kelly Taylor, Amitava Chatterjee | 2000-09-05 |
| 6086952 | Chemical vapor deposition of a copolymer of p-xylylene and a multivinyl silicon/oxygen comonomer | Chi-I Lang, Yeming Jim Ma, Fong Chang, Peter Wai-Man Lee, David Cheung | 2000-07-11 |
| 6072227 | Low power method of depositing a low k dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2000-06-06 |
| 6063714 | Nanoporous dielectric thin film surface modification | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman | 2000-05-16 |
| 6054769 | Low capacitance interconnect structures in integrated circuits having an adhesion and protective overlayer for low dielectric materials | — | 2000-04-25 |
| 6054379 | Method of depositing a low k dielectric with organo silane | Wai-Fan Yau, David Cheung, Kuowei Liu, Yung-Cheng Yu | 2000-04-25 |
| 6008117 | Method of forming diffusion barriers encapsulating copper | Qi-Zhong Hong, Wei-Yung Hsu | 1999-12-28 |
| 5985763 | Method for producing barrier-less plug structures | Qi-Zhong Hong, Wei-Yung Hsu | 1999-11-16 |
| 5955140 | Low volatility solvent-based method for forming thin film nanoporous aerogels on semiconductor substrates | Douglas M. Smith, Gregory P. Johnston, William C. Ackerman, Richard Stoltz, Alok Maskara +2 more | 1999-09-21 |
| 5936295 | Multilevel interconnect structure with air gaps formed between metal leads | Robert H. Havemann | 1999-08-10 |
| 5936306 | TiSi.sub.2 /TiN clad interconnect technology | — | 1999-08-10 |
| 5923074 | Low capacitance interconnect structure for integrated circuits using decomposed polymers | — | 1999-07-13 |
| 5892282 | Barrier-less plug structure | Qi-Zhong Hong, Wei-Yung Hsu | 1999-04-06 |
| 5858871 | Porous insulator for line-to-line capacitance reduction | — | 1999-01-12 |
| 5821621 | Low capacitance interconnect structure for integrated circuits | — | 1998-10-13 |
| 5818111 | Low capacitance interconnect structures in integrated circuits using a stack of low dielectric materials | Kelly Taylor | 1998-10-06 |
| 5814558 | Interconnect capacitance between metal leads | Robert H. Havemann | 1998-09-29 |
| 5772485 | Method of making a hydrogen-rich, low dielectric constant gate insulator for field emission device | Bruce E. Gnade | 1998-06-30 |