Issued Patents All Time
Showing 26–50 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510590 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Raashina Humayun, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2019-12-17 |
| 10438847 | Manganese barrier and adhesion layers for cobalt | Chiukin Steven Lai, Jeong-Seok Na, Raashina Humayun, Kaihan Ashtiani | 2019-10-08 |
| 10256142 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2019-04-09 |
| 10170320 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Raashina Humayun | 2019-01-01 |
| 10128116 | Integrated direct dielectric and metal deposition | William T. Lee, Bart J. van Schravendijk, David Charles Smith, Patrick A. Van Cleemput, Ramesh Chandrasekharan | 2018-11-13 |
| 10103058 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2018-10-16 |
| 10087523 | Vapor delivery method and apparatus for solid and liquid precursors | Joshua Collins, Eric H. Lenz | 2018-10-02 |
| 9997405 | Feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2018-06-12 |
| 9978605 | Method of forming low resistivity fluorine free tungsten film without nucleation | Hanna Bamnolker, Joshua Collins, Tomas Sadilek, Hyeong Seop Shin, Xiaolan Ba +2 more | 2018-05-22 |
| 9972504 | Atomic layer etching of tungsten for enhanced tungsten deposition fill | Chiukin Steven Lai, Keren Jacobs Kanarik, Samantha Tan, Anand Chandrashekar, Teh-Tien Su +2 more | 2018-05-15 |
| 9953984 | Tungsten for wordline applications | Hanna Bamnolker, Raashina Humayun, Juwen Gao | 2018-04-24 |
| 9748137 | Method for void-free cobalt gap fill | Chiukin Steven Lai, Jeong-Seok Na, Raihan M. Tarafdar, Raashina Humayun | 2017-08-29 |
| 9673146 | Low temperature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Anand Chandrashekar | 2017-06-06 |
| 9653353 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2017-05-16 |
| 9613818 | Deposition of low fluorine tungsten by sequential CVD process | Xiaolan Ba, Raashina Humayun, Lawrence Schloss | 2017-04-04 |
| 9595470 | Methods of preparing tungsten and tungsten nitride thin films using tungsten chloride precursor | Hanna Bamnolker, Raashina Humayun, Juwen Gao, Joshua Collins | 2017-03-14 |
| 9508593 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Erich R. Klawuhn | 2016-11-29 |
| 9502238 | Deposition of conformal films by atomic layer deposition and atomic layer etch | Jon Henri, Shane Tang | 2016-11-22 |
| 9478411 | Method to tune TiOx stoichiometry using atomic layer deposited Ti film to minimize contact resistance for TiOx/Ti based MIS contact scheme for CMOS | Shruti Vivek Thombare, Ishtak Karim, Sanjay Gopinath, Reza Arghavani | 2016-10-25 |
| 9478438 | Method and apparatus to deposit pure titanium thin film at low temperature using titanium tetraiodide precursor | Shruti Vivek Thombare, Ishtak Karim, Sanjay Gopinath | 2016-10-25 |
| 9362163 | Methods and apparatuses for atomic layer cleaning of contacts and vias | Juwen Gao, Aaron R. Fellis, Francisco Juarez, Chiukin Steven Lai | 2016-06-07 |
| 9355886 | Conformal film deposition for gapfill | Shankar Swaminathan, Bart J. van Schravendijk, Adrien LaVoie, Sesha Varadarajan, Jason D. Park +1 more | 2016-05-31 |
| 9349637 | Method for void-free cobalt gap fill | Jeong-Seok Na, Tianhua Yu, Sanjay Gopinath | 2016-05-24 |
| 9257302 | CVD flowable gap fill | Feng Wang, Victor Lu, Brian Lu, Wai-Fan Yau, Nerissa Draeger +4 more | 2016-02-09 |
| 9240347 | Tungsten feature fill | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2016-01-19 |