Issued Patents All Time
Showing 51–75 of 92 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9236297 | Low tempature tungsten film deposition for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Anand Chandrashekar | 2016-01-12 |
| 9159571 | Tungsten deposition process using germanium-containing reducing agent | Raashina Humayun, Sudha Manandhar | 2015-10-13 |
| 9099535 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Erich R. Klawuhn | 2015-08-04 |
| 9034768 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Aaron R. Fellis, Sean Chang | 2015-05-19 |
| 8975184 | Methods of improving tungsten contact resistance in small critical dimension features | Feng Chen, Tsung-Han Yang, Juwen Gao | 2015-03-10 |
| 8883637 | Systems and methods for controlling etch selectivity of various materials | Esther Jeng, Anand Chandrashekar, Raashina Humayun, Ronald A. Powell | 2014-11-11 |
| 8835317 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Aaron R. Fellis, Sean Chang | 2014-09-16 |
| 8778797 | Systems and methods for selective tungsten deposition in vias | Juwen Gao, Rajkumar Jakkaraju, Wei Lei | 2014-07-15 |
| 8709948 | Tungsten barrier and seed for copper filled TSV | Tom Mountsier, Jonathan D. Reid, Juwen Gao, Aaron R. Fellis | 2014-04-29 |
| 8685867 | Premetal dielectric integration process | Bart van Schravendijk, Nerissa Draeger, Lakshminarayana Nittala | 2014-04-01 |
| 8679972 | Method of depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki, Erich R. Klawuhn | 2014-03-25 |
| 8623733 | Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects | Feng Chen, Raashina Humayun, Anand Chandrashekar | 2014-01-07 |
| 8617982 | Subtractive patterning to define circuit components | Juwen Gao, Ronald A. Powell, Aaron R. Fellis | 2013-12-31 |
| 8435894 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Aaron R. Fellis, Sean Chang | 2013-05-07 |
| 8409987 | Method for depositing thin tungsten film with low resistivity and robust micro-adhesion characteristics | Anand Chandrashekar, Mirko Glass, Raashina Humayun, Kaihan Ashtiani, Feng Chen +2 more | 2013-04-02 |
| 8207062 | Method for improving adhesion of low resistivity tungsten/tungsten nitride layers | Juwen Gao, Wei Lei, Erich R. Klawuhn, Sean Chang, Ron Powell | 2012-06-26 |
| 8153520 | Thinning tungsten layer after through silicon via filling | Anand Chandrashekar, Raashina Humayun | 2012-04-10 |
| 8124531 | Depositing tungsten into high aspect ratio features | Anand Chandrashekar, Raashina Humayun, Aaron R. Fellis, Sean Chang | 2012-02-28 |
| 8119527 | Depositing tungsten into high aspect ratio features | Anand Chadrashekar, Raashina Humayun, Aaron R. Fellis, Sean Chang | 2012-02-21 |
| 7732314 | Method for depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki | 2010-06-08 |
| 7199048 | Method for preventing metalorganic precursor penetration into porous dielectrics | Karen Chu, Anil Vijayendran | 2007-04-03 |
| 7186648 | Barrier first method for single damascene trench applications | Robert T. Rozbicki | 2007-03-06 |
| 7037830 | PVD deposition process for enhanced properties of metal films | Michael Rumer, Jack Griswold, Tom Dorsh, Michael Ng, David E. Reedy +2 more | 2006-05-02 |
| 6797642 | Method to improve barrier layer adhesion | Karen Chu, Anil Vijayendran | 2004-09-28 |
| 6764940 | Method for depositing a diffusion barrier for copper interconnect applications | Robert T. Rozbicki | 2004-07-20 |