Issued Patents All Time
Showing 76–100 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7592685 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2009-09-22 |
| 7498256 | Copper contact via structure using hybrid barrier layer | Randolph F. Knarr, Christopher D. Sheraw, Anna W. Topol, Yun-Yu Wang, Keith Kwong Hon Wong | 2009-03-03 |
| 7494915 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +8 more | 2009-02-24 |
| 7446036 | Gap free anchored conductor and dielectric structure and method for fabrication thereof | Tibor Bolom, Stephan Grunow, David L. Rath | 2008-11-04 |
| 7405147 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2008-07-29 |
| 7300867 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Michael Lane | 2007-11-27 |
| 7241681 | Bilayered metal hardmasks for use in dual damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2007-07-10 |
| 7241696 | Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer | Larry Clevenger, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor, Kaushik A. Kumar +5 more | 2007-07-10 |
| 7227265 | Electroplated copper interconnection structure, process for making and electroplating bath | Panayotis Andricacos, Steven H. Boettcher, Dean S. Chung, Hariklia Deligianni, James E. Fluegel +6 more | 2007-06-05 |
| 7122462 | Back end interconnect with a shaped interface | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +8 more | 2006-10-17 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7052621 | Bilayered metal hardmasks for use in Dual Damascene etch schemes | Kaushik A. Kumar, Lawrence A. Clevenger, Timothy J. Dalton, Douglas C. La Tulipe, Jr., Andy Cowley +5 more | 2006-05-30 |
| 7037834 | Constant emissivity deposition member | Fenton R. McFeely, John J. Yurkas, Sandra G. Malhotra | 2006-05-02 |
| 7001835 | Crystallographic modification of hard mask properties | Lawrence A. Clevenger, Andrew P. Cowley, Timothy J. Dalton, Mark Hoinkis, Steffen K. Kaldor +3 more | 2006-02-21 |
| 6975032 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2005-12-13 |
| 6960519 | Interconnect structure improvements | Timothy J. Dalton, John A. Fitzsimmons, Jeffrey P. Gambino, Lee M. Nicholson, Anthony K. Stamper | 2005-11-01 |
| 6958540 | Dual damascene interconnect structures having different materials for line and via conductors | Jeffrey P. Gambino, Edward C. Cooney, III, Anthony K. Stamper, William T. Motsiff, Michael Lane | 2005-10-25 |
| 6949461 | Method for depositing a metal layer on a semiconductor interconnect structure | Sandra G. Malhotra | 2005-09-27 |
| 6924223 | Method of forming a metal layer using an intermittent precursor gas flow process | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Mitsuhiro Tachibana +6 more | 2005-08-02 |
| 6784105 | Simultaneous native oxide removal and metal neutral deposition method | Chih-Chao Yang, Yun-Yu Wang, Larry Clevenger, Stephen E. Greco, Kaushik Chanda +3 more | 2004-08-31 |
| 6768203 | Open-bottomed via liner structure and method for fabricating same | Cyprian Emeka Uzoh | 2004-07-27 |
| 6660330 | Method for depositing metal films onto substrate surfaces utilizing a chamfered ring support | Peter S. Locke, Sandra G. Malhotra, Fenton R. McFeely, John J. Yurkas | 2003-12-09 |
| 6661097 | Ti liner for copper interconnect with low-k dielectric | Larry Clevenger, Stanley J. Klepeis, Hsiao-Ling Lu, Jeffrey R. Marino, Yun-Yu Wang +2 more | 2003-12-09 |
| 6572982 | Electromigration-resistant copper microstructure | Cyprian Emeka Uzoh, Steven H. Boettcher, Patrick W. DeHaven, Christopher C. Parks | 2003-06-03 |
| 6569783 | Graded composition diffusion barriers for chip wiring applications | Cyprian Emeka Uzoh, Daniel C. Edelstein | 2003-05-27 |