AS

Andrew H. Simon

IBM: 96 patents #604 of 70,183Top 1%
Globalfoundries: 17 patents #201 of 4,424Top 5%
Infineon Technologies Ag: 7 patents #1,452 of 7,486Top 20%
AM AMD: 3 patents #3,141 of 9,279Top 35%
SS Stmicroelectronics Sa: 3 patents #449 of 1,676Top 30%
RE Renesas Electronics: 2 patents #1,855 of 4,529Top 45%
TL Tokyo Electron Limited: 1 patents #3,538 of 5,567Top 65%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
📍 Fishkill, NY: #4 of 387 inventorsTop 2%
🗺 New York: #433 of 115,490 inventorsTop 1%
Overall (All Time): #11,293 of 4,157,543Top 1%
113
Patents All Time

Issued Patents All Time

Showing 101–113 of 113 patents

Patent #TitleCo-InventorsDate
6465376 Method and structure for improving electromigration of chip interconnects Cyprian Emeka Uzoh, Daniel C. Edelstein 2002-10-15
6399496 Copper interconnection structure incorporating a metal seed layer Daniel C. Edelstein, James M. E. Harper, Chao-Kun Hu, Cyprian Emeka Uzoh 2002-06-04
6380075 Method for forming an open-bottom liner for a conductor in an electronic structure and device formed Cyril Cabral, Jr., Chao-Kun Hu, Sandra G. Malhotra, Fenton R. McFeely, Stephen M. Rossnagel 2002-04-30
6380628 Microstructure liner having improved adhesion John A. Miller, Jill Slattery, Cyprian Emeka Uzoh, Yun-Yu Wang 2002-04-30
6339022 Method of annealing copper metallurgy Arne Ballantine, Edward C. Cooney, III, George A. Dunbar, III, Cheryl G. Faltermeier, Jeffrey D. Gilbert +9 more 2002-01-15
6337151 Graded composition diffusion barriers for chip wiring applications Cyprian Emeka Uzoh, Daniel C. Edelstein 2002-01-08
6238532 Radio-frequency coil for use in an ionized physical vapor deposition apparatus Stephen M. Rossnagel, Darryl D. Restaino, Pavel Smetana 2001-05-29
6181012 Copper interconnection structure incorporating a metal seed layer Daniel C. Edelstein, James M. E. Harper, Chao-Kun Hu, Cyprian Emeka Uzoh 2001-01-30
6176931 Wafer clamp ring for use in an ionized physical vapor deposition apparatus Darryl D. Restaino, Stephen M. Rossnagel, Pavel Smetana, Edward C. Cooney, III 2001-01-23
6123825 Electromigration-resistant copper microstructure and process of making Cyprian Emeka Uzoh, Steven H. Boettcher, Patrick W. DeHaven, Christopher C. Parks 2000-09-26
5933753 Open-bottomed via liner structure and method for fabricating same Cyprian Emeka Uzoh 1999-08-03
5268069 Safe method for etching silicon dioxide Jonathan D. Chapple-Sokol, Richard A. Conti, David E. Kotecki, Manu J. Tejwani 1993-12-07
4323398 Performing maintenance operations on heat exchanger tube bundles 1982-04-06