Issued Patents All Time
Showing 176–200 of 222 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8741775 | Method of patterning a low-K dielectric film | Srinivas D. Nemani, Yifeng Zhou, Ellie Yieh | 2014-06-03 |
| 8742665 | Plasma source design | Jang-Gyoo Yang, Matthew L. Miller, Jay D. Pinson, II, Kien N. Chuc | 2014-06-03 |
| 8709953 | Pulsed plasma with low wafer temperature for ultra thin layer etches | Thorsten Lill, Klaus Schuegraf | 2014-04-29 |
| 8524004 | Loadlock batch ozone cure | Jay D. Pinson, II, Kirby H. Floyd, Adib Khan, Shankar Venkataraman | 2013-09-03 |
| 8409355 | Low profile process kit | Muhammad M. Rasheed, Teruki Iwashita, Hiroshi Otake, Yuki Koga, Kazutoshi Maehara +2 more | 2013-04-02 |
| 8357435 | Flowable dielectric equipment and processes | Qiwei Liang, Jang-Gyoo Yang | 2013-01-22 |
| 8333842 | Apparatus for etching semiconductor wafers | Tien Fak Tan, Lun Tsuei | 2012-12-18 |
| 8232176 | Dielectric deposition and etch back processes for bottom up gapfill | Srinivas D. Nemani, Ellie Yieh | 2012-07-31 |
| 8108981 | Method of making an electrostatic chuck with reduced plasma penetration and arcing | Kadthala Ramaya Narendranath, Xinglong Chen, Sudhir Gondhalekar, Muhammad M. Rasheed, Tony Kaushal | 2012-02-07 |
| 8022377 | Method and apparatus for excimer curing | Muhammad M. Rasheed, Ellie Yieh | 2011-09-20 |
| 7989365 | Remote plasma source seasoning | Soonam Park, Soo Hyun Jeon, Toan Q. Tran, Jang-Gyoo Yang, Qiwei Liang | 2011-08-02 |
| 7972968 | High density plasma gapfill deposition-etch-deposition process etchant | Young S. Lee, Ying Rui, Daniel J. Hoffman, Jang-Gyoo Yang, Anchuan Wang | 2011-07-05 |
| 7964040 | Multi-port pumping system for substrate processing chambers | Muhammad M. Rasheed, James Santosa | 2011-06-21 |
| 7848076 | Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing | Kadthala Ramaya Narendranath, Xinglong Chen, Sudhir Goodhalekar, Muhammad M. Rasheed, Tony Kaushal | 2010-12-07 |
| 7827930 | Apparatus for electroless deposition of metals onto semiconductor substrates | Arulkumar Shanmugasundram, Russell C. Ellwanger, Ian Pancham, Ramakrishna Cheboli, Timothy Weidman | 2010-11-09 |
| 7789993 | Internal balanced coil for inductively coupled high density plasma processing chamber | Robert Chen, Canfeng Lai, Xinglong Chen, Weiyi Luo, Zhong Qiang Hua +4 more | 2010-09-07 |
| 7654221 | Apparatus for electroless deposition of metals onto semiconductor substrates | Arulkumar Shanmugasundram, Ian Pancham | 2010-02-02 |
| 7651934 | Process for electroless copper deposition | Timothy Weidman, Arulkumar Shanmugasundram, Nicolay Kovarsky, Kapila Wijekoon | 2010-01-26 |
| 7572647 | Internal balanced coil for inductively coupled high density plasma processing chamber | Robert Chen, Canfeng Lai, Xinglong Chen, Weiyi Luo, Zhong Qiang Hua +4 more | 2009-08-11 |
| 7473339 | Slim cell platform plumbing | Allen L. D'Ambra, Arulkumar Shanmugasundram, Michael Yang, Yevgeniy Rabinovich | 2009-01-06 |
| 7465358 | Measurement techniques for controlling aspects of a electroless deposition process | Timothy Weidman | 2008-12-16 |
| 7341633 | Apparatus for electroless deposition | Arulkumar Shanmugasundram, Ian Pancham, Sergey Lopatin | 2008-03-11 |
| 7323058 | Apparatus for electroless deposition of metals onto semiconductor substrates | Arulkumar Shanmugasundram, Russell C. Ellwanger, Ian Pancham, Ramakrishna Cheboli | 2008-01-29 |
| 7285195 | Electric field reducing thrust plate | Harald Herchen, Bo Zheng, Lily Pang | 2007-10-23 |
| 7273535 | Insoluble anode with an auxiliary electrode | Nicolay Kovarsky, Yevgeniy Rabinovich | 2007-09-25 |