Issued Patents All Time
Showing 26–50 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6869838 | Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications | Kam S. Law, Quanyuan Shang, William Harshbarger | 2005-03-22 |
| 6829056 | Monitoring dimensions of features at different locations in the processing of substrates | Michael Barnes, John D. Holland, II, Hongqing Shan, Bryan Pu, Mohit Jain +5 more | 2004-12-07 |
| 6825134 | Deposition of film layers by alternately pulsing a precursor and high frequency power in a continuous gas flow | Kam S. Law, Quanyuan Shang, William Harshbarger, Soo Young Choi, Beom Soo Park +2 more | 2004-11-30 |
| 6770134 | Method for fabricating waveguides | Arkadii V. Samoilov | 2004-08-03 |
| 6721162 | Electrostatic chuck having composite dielectric layer and method of manufacture | Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Robert Steger +8 more | 2004-04-13 |
| 6610354 | Plasma display panel with a low k dielectric layer | Kam S. Law, Quanyuan Shang, Takako Takehara, Taekyung Won, William Harshbarger | 2003-08-26 |
| 6576110 | Coated anode apparatus and associated method | — | 2003-06-10 |
| 6514850 | Interface with dielectric layer and method of making | Li-Qun Xia, Huong Nguyen, Ellie Yieh | 2003-02-04 |
| 6503375 | Electroplating apparatus using a perforated phosphorus doped consumable anode | Ashok Sinha | 2003-01-07 |
| 6468601 | Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology | Quanyuan Shang, Robert Robertson, Kam S. Law | 2002-10-22 |
| 6444277 | Method for depositing amorphous silicon thin films onto large area glass substrates by chemical vapor deposition at high deposition rates | Kam S. Law, Robert Robertson, Pamela Lou, Marc M. Kollrack, Angela Lee | 2002-09-03 |
| 6414834 | Dielectric covered electrostatic chuck | Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Robert Steger +8 more | 2002-07-02 |
| 6372633 | Method and apparatus for forming metal interconnects | Ashok Sinha, Zheng Xu, Liang Chen, Roderick C. Mosely, Daniel Carl +3 more | 2002-04-16 |
| 6338874 | Method for multilayer CVD processing in a single chamber | Kam S. Law, Robert Robertson, Pamela Lou, Marc M. Kollrack, Angela Lee | 2002-01-15 |
| 6170428 | Symmetric tunable inductively coupled HDP-CVD reactor | Fred C. Redeker, Farhad Moghadam, Hiroji Hanawa, Tetsuya Ishikawa, Shijian Li +5 more | 2001-01-09 |
| 6167834 | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 2001-01-02 |
| 6109206 | Remote plasma source for chamber cleaning | Romuald Nowak, Ashok Sinha | 2000-08-29 |
| 6108189 | Electrostatic chuck having improved gas conduits | Edwin C. Weldon, Kenneth S. Collins, Arik Donde, Brian Lue, Robert Steger +8 more | 2000-08-22 |
| 6055927 | Apparatus and method for white powder reduction in silicon nitride deposition using remote plasma source cleaning technology | Quanyuan Shang, Robert Robertson, Kam S. Law | 2000-05-02 |
| RE36623 | Process for PECVD of silicon oxide using TEOS decomposition | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 2000-03-21 |
| 6040022 | PECVD of compounds of silicon from silane and nitrogen | Mei Chang, David N. Wang, John M. White | 2000-03-21 |
| 6020270 | Bomine and iodine etch process for silicon and silicides | Jerry Wong, David N. Wang, Mei Chang, Alfred Mak | 2000-02-01 |
| 5904776 | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck | Arik Donde, Robert Steger, Edwin C. Weldon, Brian Lue, Timothy Dyer | 1999-05-18 |
| 5892328 | High-power, plasma-based, reactive species generator | Quanyuan Shang, Kam S. Law | 1999-04-06 |
| 5885358 | Gas injection slit nozzle for a plasma process reactor | Steve S. Y. Mak, Donald Olgado, Gerald Yin, Timothy D. Driscoll, James S. Papanu +1 more | 1999-03-23 |