Issued Patents All Time
Showing 76–100 of 101 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5223457 | High-frequency semiconductor wafer processing method using a negative self-bias | Donald M. Mintz, Hiroji Hanawa, Sasson Someskh | 1993-06-29 |
| 5215619 | Magnetic field-enhanced plasma etch reactor | David Cheng, Sasson Somekh, Kenneth R. Stalder, Dana L. Andrews, Mei Chang +4 more | 1993-06-01 |
| 5210466 | VHF/UHF reactor system | Kenneth S. Collins, Craig A. Roderick, Chan-Lon Yang, David N. Wang | 1993-05-11 |
| 5204288 | Method for planarizing an integrated circuit structure using low melting inorganic material | Jeffrey Marks, Kam S. Law, David N. Wang | 1993-04-20 |
| 5186718 | Staged-vacuum wafer processing system and method | Avi Tepman, Howard Grunes, Sasson Somekh | 1993-02-16 |
| 5098198 | Wafer heating and monitor module and method of operation | Jaim Nulman | 1992-03-24 |
| 5000113 | Thermal CVD/PECVD reactor and use for thermal chemical vapor deposition of silicon dioxide and in-situ multi-step planarized process | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1991-03-19 |
| 4962063 | Multistep planarized chemical vapor deposition process with the use of low melting inorganic material for flowing while depositing | David N. Wang | 1990-10-09 |
| 4951601 | Multi-chamber integrated process system | Sasson Somekh, David N. Wang, David Cheng, Masato Toshima, Isaac Harari +1 more | 1990-08-28 |
| 4911597 | Semiconductor processing system with robotic autoloader and load lock | Sasson Somekh, Charles Ryan-Harris, Richard A. Seilheimer, David Cheng, Edward M. Abolnikov +5 more | 1990-03-27 |
| 4892753 | Process for PECVD of silicon oxide using TEOS decomposition | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1990-01-09 |
| 4872947 | CVD of silicon oxide using TEOS decomposition and in-situ planarization process | David N. Wang, John M. White, Kam S. Law, Cissy Leung, Salvador P. Umotoy +3 more | 1989-10-10 |
| 4854263 | Inlet manifold and methods for increasing gas dissociation and for PECVD of dielectric films | Mei Chang, David N. Wang, John M. White | 1989-08-08 |
| 4842683 | Magnetic field-enhanced plasma etch reactor | David Cheng, Sasson Somekh, Kenneth R. Stalder, Dana L. Andrews, Mei Chang +4 more | 1989-06-27 |
| 4668338 | Magnetron-enhanced plasma etching process | Sasson Somekh, Mei Cheng, David Cheng | 1987-05-26 |
| 4668365 | Apparatus and method for magnetron-enhanced plasma-assisted chemical vapor deposition | Robert F. Foster, David N. Wang, Sasson Somekh | 1987-05-26 |
| 4618262 | Laser interferometer system and method for monitoring and controlling IC processing | Sasson Somekh, Edward M. Kaczorowski | 1986-10-21 |
| 4412885 | Materials and methods for plasma etching of aluminum and aluminum alloys | David N. Wang, Frank D. Egitto | 1983-11-01 |
| 4383885 | Reactive sputter etching of polysilicon utilizing a chlorine etch gas | David N. Wang | 1983-05-17 |
| 4376672 | Materials and methods for plasma etching of oxides and nitrides of silicon | David N. Wang, Frank D. Egitto | 1983-03-15 |
| 4310380 | Plasma etching of silicon | Daniel Flamm, David N. Wang | 1982-01-12 |
| 4298443 | High capacity etching apparatus and method | — | 1981-11-03 |
| 4253029 | Mask structure for x-ray lithography | Martin P. Lepselter, Hyman J. Levinstein | 1981-02-24 |
| 4244799 | Fabrication of integrated circuits utilizing thick high-resolution patterns | David B. Fraser, Joseph M. Moran | 1981-01-13 |
| 4227088 | High speed computer assisted tomography | Lawrence Shepp | 1980-10-07 |