Issued Patents All Time
Showing 1,576–1,600 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8567837 | Reconfigurable guide pin design for centering wafers having different sizes | Hsin Chang, Hsin-Yu Chen, Fang Wen Tsai, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2013-10-29 |
| 8569086 | Semiconductor device and method of dicing semiconductor devices | Jing-Cheng Lin, Chih-Wei Wu, Szu-Wei Lu, Shin-Puu Jeng | 2013-10-29 |
| 8558229 | Passivation layer for packaged chip | Shin-Puu Jeng, Wei-Cheng Wu, Shang-Yun Hou, Tzuan-Horng Liu, Tzu-Wei Chiu +1 more | 2013-10-15 |
| 8557684 | Three-dimensional integrated circuit (3DIC) formation process | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng | 2013-10-15 |
| 8557631 | Interposer wafer bonding method and apparatus | Chien-Chia Chiu, Cheng-Chieh Hsieh | 2013-10-15 |
| 8540136 | Methods for stud bump formation and apparatus for performing the same | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Yi-Li Hsiao, Chung-Shi Liu +1 more | 2013-09-24 |
| 8540506 | Semiconductor molding chamber | Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2013-09-24 |
| 8531032 | Thermally enhanced structure for multi-chip device | Chih-Hang Tung, Tung-Liang Shao | 2013-09-10 |
| 8531035 | Interconnect barrier structure and method | Wen-Chih Chiou, Tsang-Jiuh Wu | 2013-09-10 |
| 8528802 | Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects | Wen-Chih Chiou, Weng-Jin Wu | 2013-09-10 |
| 8525216 | Light-emitting diode integration scheme | Ding-Yuan Chen, Wen-Chih Chiou | 2013-09-03 |
| 8525343 | Device with through-silicon via (TSV) and method of forming the same | Wen-Chih Chiou, Ebin Liao, Tsang-Jiuh Wu | 2013-09-03 |
| 8525200 | Light-emitting diode with non-metallic reflector | Ding-Yuan Chen, Wen-Chih Chiou | 2013-09-03 |
| 8518796 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2013-08-27 |
| 8519537 | 3D semiconductor package interposer with die cavity | Shin-Puu Jeng, Kim Hong Chen, Shang-Yun Hou, Chao-Wen Shih, Cheng-Chieh Hsieh | 2013-08-27 |
| 8519414 | III-nitride based semiconductor structure with multiple conductive tunneling layer | Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou | 2013-08-27 |
| 8518753 | Assembly method for three dimensional integrated circuit | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng | 2013-08-27 |
| 8513119 | Method of forming bump structure having tapered sidewalls for stacked dies | Hung-Pin Chang, Kuo-Ching Hsu, Chen-Shien Chen, Wen-Chih Chiou | 2013-08-20 |
| 8507940 | Heat dissipation by through silicon plugs | Hung-Pin Chang, Yung-Chi Lin, Chia-Lin Yu, Jui-Pin Hung, Chien Ling Hwang | 2013-08-13 |
| 8500182 | Vacuum wafer carriers for strengthening thin wafers | Ku-Feng Yang, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou | 2013-08-06 |
| 8501616 | Self-aligned protection layer for copper post structure | Chung-Shi Liu | 2013-08-06 |
| 8501613 | UBM etching methods for eliminating undercut | Yi-Yang Lei, Hung-Jui Kuo, Chung-Shi Liu, Mirng-Ji Lii | 2013-08-06 |
| 8492891 | Cu pillar bump with electrolytic metal sidewall protection | Wen-Hsiung Lu, Ming-Da Cheng, Chih-Wei Lin, Jacky Chang, Chung-Shi Liu | 2013-07-23 |
| 8486807 | Realizing N-face III-nitride semiconductors by nitridation treatment | Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou | 2013-07-16 |
| 8486730 | Method of separating light-emitting diode from a growth substrate | Ding-Yuan Chen, Hung-Ta Lin, Wen-Chih Chiou | 2013-07-16 |