Issued Patents All Time
Showing 1,551–1,575 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8647796 | Photoactive compound gradient photoresist | Chung-Shi Liu, Hung-Jui Kuo | 2014-02-11 |
| 8643147 | Seal ring structure with improved cracking protection and reduced problems | Shin-Puu Jeng, Shih-Hsun Hsu, Shang-Yun Hou, Hao-Yi Tsai | 2014-02-04 |
| 8643196 | Structure and method for bump to landing trace ratio | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Sheng-Yu Wu, Yen-Liang Lin | 2014-02-04 |
| 8642393 | Package on package devices and methods of forming same | Mirng-Ji Lii, Chien-Hsun Lee, Yung Ching Chen, Jiun Yi Wu | 2014-02-04 |
| 8629560 | Self aligned air-gap in interconnect structures | Chung-Shi Liu | 2014-01-14 |
| 8629568 | Semiconductor device cover mark | Yan-Fu Lin, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng | 2014-01-14 |
| 8629053 | Plasma treatment for semiconductor devices | Chen-Fa Lu, Chung-Shi Liu, Wei-Yu Chen, Cheng-Ting Chen | 2014-01-14 |
| 8629042 | Method for stacking semiconductor dies | Ku-Feng Yang, Weng-Jin Wu, Wen-Chih Chiou | 2014-01-14 |
| 8629056 | Method for forming self-assembled mono-layer liner for cu/porous low-k interconnections | Chung-Chi Ko, Chia-Cheng Chou, Keng-Chu Lin, Tien-I Bao | 2014-01-14 |
| 8629066 | Liner formation in 3DIC structures | Ching-Yu Lo, Hung-Jung Tu, Hai-Ching Chen, Tien-I Bao, Wen-Chih Chiou | 2014-01-14 |
| 8629465 | Light-emitting diodes on concave texture substrate | Hung-Ta Lin, Wen-Chih Chiou, Ding-Yuan Chen, Chia-Lin Yu | 2014-01-14 |
| 8623760 | Process for improving copper line cap formation | Chien-Hsueh Shih, Minghsing Tsai, Ming-Shih Yeh | 2014-01-07 |
| 8623755 | Self-aligned protection layer for copper post structure | Chung-Shi Liu | 2014-01-07 |
| 8617948 | Reducing resistance in source and drain regions of FinFETs | Yu-Rung Hsu, Chen-Nan Yeh, Cheng-Hung Chang | 2013-12-31 |
| 8618668 | Semiconductor contact barrier | Chung-Shi Liu | 2013-12-31 |
| 8618827 | Measurement of electrical and mechanical characteristics of low-K dielectric in a semiconductor device | Tung-Liang Shao, Shih-Wei Liang, Ying-Ju Chen, Ching-Jung Yang, Hsien-Wei Chen +2 more | 2013-12-31 |
| 8617946 | Integrated circuits including metal gates and fabrication methods thereof | Chung-Shi Liu | 2013-12-31 |
| 8609448 | Omnidirectional reflector | Ding-Yuan Chen, Wen-Chih Chiou | 2013-12-17 |
| 8610285 | 3D IC packaging structures and methods with a metal pillar | Shin-Puu Jeng, Shang-Yun Hou, Kuo-Ching Hsu, Cheng-Chieh Hsieh, Ying-Ching Shih +3 more | 2013-12-17 |
| 8592995 | Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump | Jing-Cheng Lin | 2013-11-26 |
| 8592300 | Interface structure for copper-copper peeling integrity | Cheng-Chung Lin, Chung-Sui Liu | 2013-11-26 |
| 8580614 | Embedded wafer-level bonding approaches | Jing-Cheng Lin | 2013-11-12 |
| 8581402 | Molded chip interposer structure and methods | Chun-Hui Yu, Jing-Cheng Lin | 2013-11-12 |
| 8581418 | Multi-die stacking using bumps with different sizes | Weng-Jin Wu, Ying-Ching Shih, Wen-Chih Chiou, Shin-Puu Jeng | 2013-11-12 |
| 8575725 | Through-silicon vias for semicondcutor substrate and method of manufacture | Cheng-Hung Chang, Ebin Liao, Chia-Lin Yu, Hsiang-Yi Wang, Chun Hua Chang +4 more | 2013-11-05 |