Issued Patents All Time
Showing 1,501–1,525 of 1,955 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8823049 | Light-emitting diode with current-spreading region | Ding-Yuan Chen, Wen-Chih Chiou | 2014-09-02 |
| 8815618 | Light-emitting diode on a conductive substrate | Ding-Yuan Chen, Wen-Chih Chiou | 2014-08-26 |
| 8810006 | Interposer system and method | Shin-Puu Jeng, Shang-Yun Hou, Der-Chyang Yeh | 2014-08-19 |
| 8803306 | Fan-out package structure and methods for forming the same | Der-Chyang Yeh | 2014-08-12 |
| 8803323 | Package structures and methods for forming the same | Jiun Yi Wu, Tsung-Ding Wang | 2014-08-12 |
| 8803333 | Three-dimensional chip stack and method of forming the same | Da-Yuan Shih, Chih-Hang Tung | 2014-08-12 |
| 8803189 | III-V compound semiconductor epitaxy using lateral overgrowth | Chia-Lin Yu, Ding-Yuan Chen, Wen-Chih Chiou, Hung-Ta Lin | 2014-08-12 |
| 8796132 | System and method for forming uniform rigid interconnect structures | Ming-Chung Sung, Yung Ching Chen, Chien-Hsun Lee, Mirng-Ji Lii | 2014-08-05 |
| 8796758 | Selective epitaxial growth of semiconductor materials with reduced defects | Jing-Cheng Lin | 2014-08-05 |
| 8797057 | Testing of semiconductor chips with microbumps | Wei-Cheng Wu, Hsien-Pin Hu, Shang-Yun Hou, Shin-Puu Jeng, Chao-Hsiang Yang | 2014-08-05 |
| 8795486 | PVD target with end of service life detection capability | Yi-Li Hsiao, Jerry Hwang, Jyh-Cherng Sheu, Lawrance Sheu, Jean Wang | 2014-08-05 |
| 8779445 | Stress-alleviation layer for LED structures | Hung-Ta Lin, Ding-Yuan Chen, Wen-Chih Chiou, Chia-Lin Yu | 2014-07-15 |
| 8779588 | Bump structures for multi-chip packaging | Jing-Cheng Lin | 2014-07-15 |
| 8779599 | Packages including active dies and dummy dies and methods for forming the same | Jing-Cheng Lin, Cheng-Lin Huang, Szu-Wei Lu, Jui-Pin Hung, Shin-Puu Jeng | 2014-07-15 |
| 8766309 | Omnidirectional reflector | Ding-Yuan Chen, Wen-Chih Chiou | 2014-07-01 |
| 8765556 | Method of fabricating strained structure in semiconductor device | Yu-Rung Hsu, Chao-Cheng Chen, Ming-Huan Tsai, Hsien-Hsin Lin, Hsueh-Chang Sung | 2014-07-01 |
| 8759949 | Wafer backside structures having copper pillars | Hon-Lin Huang, Kuo-Ching Hsu, Chen-Shien Chen | 2014-06-24 |
| 8759150 | Approach for bonding dies onto interposers | Hsien-Pin Hu, Shin-Puu Jeng, Shang-Yun Hou, Jing-Cheng Lin, Wen-Chih Chiou +1 more | 2014-06-24 |
| 8754514 | Multi-chip wafer level package | Chun-Hui Yu, Chih-Hang Tung, Tung-Liang Shao, Da-Yuan Shih | 2014-06-17 |
| 8748306 | Cleaning residual molding compound on solder bumps | Yi-Yang Lei, Hung-Jui Kuo, Chung-Shi Liu, Mirng-Ji Lii | 2014-06-10 |
| 8749077 | Three-dimensional integrated circuit (3DIC) | Chih-Wei Wu, Szu-Wei Lu, Jing-Cheng Lin, Shin-Puu Jeng | 2014-06-10 |
| 8749043 | Package on package structure | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Kai-Chiang Wu | 2014-06-10 |
| 8742441 | Light-emitting diode with embedded elements | Ding-Yuan Chen, Wen-Chih Chiou | 2014-06-03 |
| 8736014 | High mechanical strength additives for porous ultra low-k material | Bo-Jiun Lin, Ching-Yu Lo, Hai-Ching Chen, Tien-I Bao | 2014-05-27 |
| 8736039 | Stacked structures and methods of forming stacked structures | Weng-Jin Wu, Wen-Chih Chiou | 2014-05-27 |