Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406914 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2025-09-02 |
| 12334242 | Coreless electronic substrates having embedded inductors | Sanka Ganesan, Robert L. Sankman, Anne Augustine, Kaladhar Radhakrishnan | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2025-06-10 |
| 12261124 | Embedded die architecture and method of making | Sanka Ganesan, Robert L. Sankman | 2025-03-25 |
| 12132015 | Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operations | William J. Lambert | 2024-10-29 |
| 12062551 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2024-08-13 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Jeremy Ecton, Hongxia Feng +9 more | 2024-07-09 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2024-03-19 |
| 11870163 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Robert L. Sankman, Shawna M. Liff, William J. Lambert, Zhichao Zhang | 2024-01-09 |
| 11869842 | Scalable high speed high bandwidth IO signaling package architecture and method of making | Sanka Ganesan, Robert L. Sankman, Arghya Sain, Lijiang Wang, Cemil Geyik | 2024-01-09 |
| 11804426 | Integrated circuit structures in package substrates | Sanka Ganesan, William J. Lambert, Zhichao Zhang, Stephen Andrew Smith, Michael J. Hill +1 more | 2023-10-31 |
| 11764150 | Inductors for package substrates | Tarek A. Ibrahim, Wei-Lun Kane Jen | 2023-09-19 |
| 11721632 | Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its making | — | 2023-08-08 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11664313 | Microelectronic device including fiber-containing build-up layers | — | 2023-05-30 |
| 11631595 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2023-04-18 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, William J. Lambert, Zhichao Zhang, Mitul Modi | 2023-03-21 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan +4 more | 2022-08-30 |
| 11393762 | Formation of tall metal pillars using multiple photoresist layers | Liwei Cheng, Siddharth K. Alur, Sheng Li | 2022-07-19 |
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sandeep Gaan +2 more | 2022-07-12 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, William J. Lambert, Zhichao Zhang, Robert L. Sankman | 2022-06-07 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, Rahul N. Manepalli, David Unruh, Frank Truong, Kyu Oh Lee +1 more | 2022-03-15 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |
| 11195727 | High density organic interconnect structures | Siddharth K. Alur, Lilia May, Amanda E. Schuckman | 2021-12-07 |
| 11196165 | Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications | Siddharth K. Alur, Sheng Li | 2021-12-07 |