Issued Patents All Time
Showing 76–100 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8089157 | Contact metallurgy structure | Cyril Cabral, Jr., Hariklia Deligianni, Randolph F. Knarr, Stephen M. Rossnagel, Xiaoyan Shao +2 more | 2012-01-03 |
| 8039383 | Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regions | David E. Lazovsky, Thomas R. Boussie | 2011-10-18 |
| 8030772 | Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region | David E. Lazovsky, Thomas R. Boussie | 2011-10-04 |
| 7977153 | Methods for forming resistive-switching metal oxides for nonvolatile memory elements | Pragati Kumar, Sean Barstow, Tony P. Chiang | 2011-07-12 |
| 7968452 | Titanium-based high-K dielectric films | Hanhong Chen, Pragati Kumar, Sunil Shanker, Edward Haywood, Imran Hashim +3 more | 2011-06-28 |
| 7927947 | Methods for depositing high-K dielectrics | Xiangxin Rui, Sunil Shanker, Imran Hashim, Edward Haywood | 2011-04-19 |
| 7884036 | Methods for treating substrates in preparation for subsequent processes | Jinhong Tong, Anh Duong, Zhi-Wen Sun, Chi-I Lang, Tony P. Chiang | 2011-02-08 |
| 7879710 | Substrate processing including a masking layer | Zachary Fresco, Chi-I Lang, Tony P. Chiang, Thomas R. Boussie, Nitin Kumar +2 more | 2011-02-01 |
| 7863087 | Methods for forming resistive-switching metal oxides for nonvolatile memory elements | Pragati Kumar, Sean Barstow, Tony P. Chiang | 2011-01-04 |
| 7851357 | Method of forming electrodeposited contacts | Cyril Cabral, Jr., Lili Deligianni, Randolph F. Knarr, Stephen M. Rossnagel, Xiaoyan Shao +2 more | 2010-12-14 |
| 7824935 | Methods of combinatorial processing for screening multiple samples on a semiconductor substrate | Gaurav Verma, Kurt H. Weiner, Prashant B. Phatak, Imran Hashim, Tony P. Chiang | 2010-11-02 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures | Stefanie Chiras, Michael Lane, Fenton R. Mc Feely, Robert Rosenberg, Carlos J. Sambucetti +1 more | 2010-11-02 |
| 7749881 | Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region | David E. Lazovsky, Thomas R. Boussie | 2010-07-06 |
| 7678421 | Method for increasing deposition rates of metal layers from metal-carbonyl precursors | Kenji Suzuki, Emmanuel Guidotti, Gerrit J. Leusink, Fenton R. McFeely | 2010-03-16 |
| 7488512 | Method for preparing solid precursor tray for use in solid precursor evaporation system | Kenji Suzuki, Emmanuel Guidotti, Gerrit J. Leusink, Masamichi Hara, Daisuke Kuroiwa +2 more | 2009-02-10 |
| 7419702 | Method for processing a substrate | Kazuhito Nakamura, Cory Wajda, Enrico Mosca, Yumiko Kawano, Gert Leusink +1 more | 2008-09-02 |
| 7405153 | Method for direct electroplating of copper onto a non-copper plateable layer | Hariklia Deligianni, Stephen M. Rossnagel, Xiaoyan Shao, Tsong-Lin Tai, Oscar van der Straten | 2008-07-29 |
| 7405154 | Structure and method of forming electrodeposited contacts | Cyril Cabral, Jr., Hariklia Deligianni, Randolph F. Knarr, Stephen M. Rossnagel, Xiaoyan Shao +2 more | 2008-07-29 |
| 7390739 | Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region | David E. Lazovsky, Thomas R. Boussie | 2008-06-24 |
| 7270848 | Method for increasing deposition rates of metal layers from metal-carbonyl precursors | Kenji Suzuki, Emmanuel Guidotti, Gerrit J. Leusink, Fenton R. McFeely | 2007-09-18 |
| 7247946 | On-chip Cu interconnection using 1 to 5 nm thick metal cap | John Bruley, Roy A. Carruthers, Lynne M. Gignac, Chao-Kun Hu, Eric G. Liniger +1 more | 2007-07-24 |
| 7098676 | Multi-functional structure for enhanced chip manufacturibility and reliability for low k dielectrics semiconductors and a crackstop integrity screen and monitor | William Francis Landers, Thomas M. Shaw, Diana Llera-Hurlburt, Scott W. Crowder, Vincent J. McGahay +3 more | 2006-08-29 |
| 7078341 | Method of depositing metal layers from metal-carbonyl precursors | Hideaki Yamasaki, Tsukasa Matsuda, Atsushi Gomi, Tatsuo Hatano, Masahito Sugiura +3 more | 2006-07-18 |
| 7064064 | Copper recess process with application to selective capping and electroless plating | Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin +11 more | 2006-06-20 |
| 7037834 | Constant emissivity deposition member | Fenton R. McFeely, John J. Yurkas, Andrew H. Simon | 2006-05-02 |