Issued Patents All Time
Showing 101–125 of 178 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7572647 | Internal balanced coil for inductively coupled high density plasma processing chamber | Robert Chen, Canfeng Lai, Xinglong Chen, Weiyi Luo, Zhong Qiang Hua +4 more | 2009-08-11 |
| 7541297 | Method and system for improving dielectric film quality for void free gap fill | Abhijit Basu Mallick, Jeffrey C. Munro, Linlin Wang, Srinivas D. Nemani, Yi Zheng +2 more | 2009-06-02 |
| 7528051 | Method of inducing stresses in the channel region of a transistor | Reza Arghavani, Zheng Yuan, Shankar Venkataraman, Nitin K. Ingle | 2009-05-05 |
| 7524750 | Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD | Srinivas D. Nemani, Young S. Lee, Anchuan Wang, Jason Bloking, Lung-Tien Han | 2009-04-28 |
| 7506654 | Accelerated plasma clean | Shankar N. Chandran, Scott A. Hendrickson, Gwendolyn D. Jones, Shankar Venkataraman | 2009-03-24 |
| 7435685 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2008-10-14 |
| 7326657 | Post-deposition treatment to enhance properties of Si-O-C low k films | Li-Qun Xia, Frederic Gaillard, Tian-Hoe Lim | 2008-02-05 |
| 7244658 | Low stress STI films and methods | Lung-Tien Han, Anchuan Wang, Lin Zhang | 2007-07-17 |
| 7160821 | Method of depositing low k films | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Wai-Fan Yau, David Cheung +5 more | 2007-01-09 |
| 7153787 | CVD plasma assisted lower dielectric constant SICOH film | Seon-Mee Cho, Peter Wai-Man Lee, Chi-I Lang, Dian Sugiarto, Chen-An Chen +2 more | 2006-12-26 |
| 7151053 | Method of depositing dielectric materials including oxygen-doped silicon carbide in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2006-12-19 |
| 7132369 | Method of forming a low-K dual damascene interconnect structure | Gerardo Delgadino, Yan Ye, Neungho Shin, Yunsang Kim, Li-Qun Xia +6 more | 2006-11-07 |
| 7117064 | Method of depositing dielectric films | Srinivas D. Nemani, Li-Qun Xia, Dian Sugiarto, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-10-03 |
| 7115534 | Dielectric materials to prevent photoresist poisoning | Son V. Nguyen, Michael D. Armacost, Mehul Naik, Girish Dixit | 2006-10-03 |
| 7087497 | Low-thermal-budget gapfill process | Zheng Yuan, Reza Arghavani, Shankar Venkataraman | 2006-08-08 |
| 7074708 | Method of decreasing the k value in sioc layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Wai-Fan Yau, Shin-Puu Jeng +2 more | 2006-07-11 |
| 7033945 | Gap filling with a composite layer | Jeong Soo Byun, Zheng Yuan, Shankar Venkataraman, M. Ziaul Karim, Thanh Pham | 2006-04-25 |
| 7008484 | Method and apparatus for deposition of low dielectric constant materials | Kang Sub Yim, Soovo Sen, Dian Sugiarto, Peter Wai-Man Lee | 2006-03-07 |
| 7001850 | Method of depositing dielectric films | Srinivas D. Nemani, Li-Qun Xia, Dian Sugiarto, Ping Xu, Francimar Campana-Schmitt +1 more | 2006-02-21 |
| 6943127 | CVD plasma assisted lower dielectric constant SICOH film | Seon-Mee Cho, Peter Wai-Man Lee, Chi-I Lang, Dian Sugiarto, Chen-An Chen +2 more | 2005-09-13 |
| 6936309 | Hardness improvement of silicon carboxy films | Lihua Li, Tzu-Fang Huang, Li-Qun Xia | 2005-08-30 |
| 6890850 | Method of depositing dielectric materials in damascene applications | Ju-Hyung Lee, Ping Xu, Shankar Venkataraman, Li-Qun Xia, Fei Han +5 more | 2005-05-10 |
| 6875558 | Integration scheme using self-planarized dielectric layer for shallow trench isolation (STI) | Frederic Gaillard, Fabrice Geiger | 2005-04-05 |
| 6858923 | Post-deposition treatment to enhance properties of Si-O-C low films | Li-Qun Xia, Frederic Gaillard, Tian-Hoe Lim | 2005-02-22 |
| 6814087 | Accelerated plasma clean | Shankar Chandran, Scott A. Hendrickson, Gwendolyn D. Jones, Shankar Venkataraman | 2004-11-09 |