Issued Patents All Time
Showing 126–150 of 178 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6815373 | Use of cyclic siloxanes for hardness improvement of low k dielectric films | Vinita Singh, Srinivas D. Nemani, Yi Zheng, Lihua Li, Tzu-Fang Huang +1 more | 2004-11-09 |
| 6806207 | Method of depositing low K films | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Wai-Fan Yau, David Cheung +5 more | 2004-10-19 |
| 6784119 | Method of decreasing the K value in SIOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Wai-Fan Yau, Shin-Puu Jeng +2 more | 2004-08-31 |
| 6764958 | Method of depositing dielectric films | Srinivas D. Nemani, Li-Qun Xia, Dian Sugiarto, Ping Xu, Francimar Campana-Schmitt +1 more | 2004-07-20 |
| 6753258 | Integration scheme for dual damascene structure | Frederic Gaillard, Li-Qun Xia, Paul Fisher, Margaret Gotuaco | 2004-06-22 |
| 6750141 | Silicon carbide cap layers for low dielectric constant silicon oxide layers | Li-Qun Xia, Paul Fisher, Margaret Gotuaco, Frederic Gaillard | 2004-06-15 |
| 6709721 | Purge heater design and process development for the improvement of low k film properties | Juan Carlos Rocha-Alvarez, Chen-An Chen, Shankar Venkataraman | 2004-03-23 |
| 6680164 | Solvent free photoresist strip and residue removal processing for post etching of low-k films | Huong Nguyen, Mark Kawaguchi, Mehul Naik, Li-Qun Xia | 2004-01-20 |
| 6635575 | Methods and apparatus to enhance properties of Si-O-C low K films | Li-Qun Xia, Frederic Gaillard, Tian-Hoe Lim | 2003-10-21 |
| 6632478 | Process for forming a low dielectric constant carbon-containing film | Frederic Gaillard, Li-Qun Xia, Jen Shu, Tian-Hoe Lim | 2003-10-14 |
| 6627532 | Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition | Frederic Gaillard, Li-Qun Xia, Tian-Hoe Lim, Wai-Fan Yau, Shin-Puu Jeng +2 more | 2003-09-30 |
| 6602806 | Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film | Li-Qun Xia, Fabrice Geiger, Frederic Gaillard, Tian-Hoe Lim | 2003-08-05 |
| 6599574 | Method and apparatus for forming a dielectric film using helium as a carrier gas | Paul Edward Gee, Li-Qun Xia, Francimar Campana, Shankar Venkataranan, Dana Tribula +1 more | 2003-07-29 |
| 6596343 | Method and apparatus for processing semiconductor substrates with hydroxyl radicals | Himanshu Pokharna, Shankar Chandran, Srinivas D. Nemani, Chen-An Chen, Francimar Campana +1 more | 2003-07-22 |
| 6593247 | Method of depositing low k films using an oxidizing plasma | Tzu-Fang Huang, Yung-Cheng Lu, Li-Qun Xia, Wai-Fan Yau, David Cheung +5 more | 2003-07-15 |
| 6589888 | Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers | Srinivas D. Nemani, Li-Qun Xia | 2003-07-08 |
| 6583497 | Surface treatment of c-doped SiO2 film to enhance film stability during O2 ashing | Li-Qun Xia, Tian-Hoe Lim, Frederic Gaillard | 2003-06-24 |
| 6573196 | Method of depositing organosilicate layers | Frederick Gaillard, Li-Qun Xia, Tian-Hoe Lim | 2003-06-03 |
| 6569257 | Method for cleaning a process chamber | Huong Nguyen, Michael Barnes, Li-Qun Xia | 2003-05-27 |
| 6531398 | Method of depositing organosillicate layers | Frederic Gaillard, Li-Qun Xia, Paul Fisher, Srinivas D. Nemani | 2003-03-11 |
| 6514850 | Interface with dielectric layer and method of making | Li-Qun Xia, Huong Nguyen, Dan Maydan | 2003-02-04 |
| 6511920 | Optical marker layer for etch endpoint determination | Huong Nguyen, Yunsang Kim, Li-Qun Xia | 2003-01-28 |
| 6503843 | Multistep chamber cleaning and film deposition process using a remote plasma that also enhances film gap fill | Li-Qun Xia | 2003-01-07 |
| 6500773 | Method of depositing organosilicate layers | Frederic Gaillard, Li-Qun Xia | 2002-12-31 |
| 6486061 | Post-deposition treatment to enhance properties of Si-O-C low K films | Li-Qun Xia, Frederic Gaillard, Tian-Hoe Lim | 2002-11-26 |