Issued Patents 2025
Showing 1–25 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431366 | Structure having thermal dissipation structure therein and manufacturing method thereof | Yian-Liang Kuo, Kuo-Chung Yee | 2025-09-30 |
| 12424576 | Integrated circuit package and method | Wen-Chih Chiou, Shih-Ting Lin, Szu-Wei Lu | 2025-09-23 |
| 12422635 | Thermo-electric cooler for dissipating heat of optical engine | Hsing-Kuo Hsia, Chih-Kuang Yu, Jui Lin Chao | 2025-09-23 |
| 12424587 | Semiconductor device having underfill surrounding bottom package and solder ball | Jing-Cheng Lin, Ying-Ching Shih, Pu Wang | 2025-09-23 |
| 12416862 | Apparatus, system and method | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-09-16 |
| 12418001 | 3D integrated circuit (3DIC) structure | Wen-Chih Chiou, Chung-Shi Liu | 2025-09-16 |
| 12417991 | Chip stack structure with conductive plug and method for forming the same | Chuei-Tang Wang, Tso-Jung Chang, Shih-Ping Lin, Jeng-Shien Hsieh, Chih-Peng Lin +1 more | 2025-09-16 |
| 12411279 | Integrated circuit package and method of forming same | Jiun Yi Wu, Szu-Wei Lu | 2025-09-09 |
| 12412799 | Integrated circuit package and method | Wei Ling Chang, Chuei-Tang Wang, Fong-Yuan Chang, Chieh-Yen Chen | 2025-09-09 |
| 12412817 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-09-09 |
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai +1 more | 2025-09-09 |
| 12412882 | Buffer design for package integration | Jie Chen, Hsien-Wei Chen, Ming-Fa Chen | 2025-09-09 |
| 12401012 | Semiconductor device package and methods of manufacture | Jiun Yi Wu | 2025-08-26 |
| 12392961 | Structure and process for photonic packages | Hsing-Kuo Hsia, Kuo-Chiang Ting | 2025-08-19 |
| 12394242 | Fingerprint sensor device and method | Yu-Chih Huang, Chih-Hua Chen, Yu-Jen Cheng, Chih-Wei Lin, Yu-Feng Chen +2 more | 2025-08-19 |
| 12394684 | Die stacking structure, semiconductor package and formation method of the die stacking structure | Su-Chun Yang, Jih-Churng Twu, Jiung Wu, Chih-Hang Tung | 2025-08-19 |
| 12394732 | Semiconductor package and method | Jiun Yi Wu, Chung-Shi Liu | 2025-08-19 |
| 12394736 | Semiconductor package system and method | Hui-Min Huang, Chih-Wei Lin, Tsai-Tsung Tsai, Ming-Da Cheng, Chung-Shi Liu | 2025-08-19 |
| 12394758 | Packages with metal line crack prevention design | Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen, Jie Chen | 2025-08-19 |
| 12388060 | Integrated fan-out packages and methods of forming the same | Kuo Lung Pan, Ting Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2025-08-12 |
| 12381176 | Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layer | Hui-Jung Tsai, Yun Chen Hsieh, Jyun-Siang Peng, Tai-Min Chang, Yi-Yang Lei +1 more | 2025-08-05 |
| 12374651 | Wafer bonding method | Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-07-29 |
| 12368141 | IPD modules with flexible connection scheme in packaging | Yu-Chia Lai, Cheng-Chieh Hsieh, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu | 2025-07-22 |
| 12368149 | Methods of forming semiconductor packages | Hao-Jan Pei, Hsiu-Jen Lin, Wei-Yu Chen, Philip Yu-Shuan Chung, Chia-Shen Cheng +3 more | 2025-07-22 |
| 12368280 | Semiconductor device and method | An-Jhih Su, Chia-Nan Yuan, Shih-Guo Shen, Der-Chyang Yeh, Yu-Hung Lin +1 more | 2025-07-22 |