Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412817 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2025-09-09 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Chen-Hua Yu, Kuo Lung Pan, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |
| 12243788 | Method of testing semiconductor package | Yang-Che Chen, Chen-Hua Lin, Victor Chiang Liang, Chwen-Ming Liu | 2025-03-04 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |